Current Affairs · 2026-06-01

Odisha signed an MoU with Intel Corporation and 3DGS Inc. to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in which region?

1. A
   Cuttack-Paradip region
2. B
   Bhubaneswar–Khurda region
3. C
   Rourkela-Sundargarh region
4. D
   Berhampur-Ganjam region